WCSE 2019 SUMMER ISBN: 978-981-14-1684-2
DOI: 10.18178/wcse.2019.06.129

The design of Push-down magnetic levitation system

Wang Yongliang, Li Xinqi, Chen Hongdou, Yan Daliang, Lu Dengcheng

Abstract— Magnetic levitation technology has the characteristics of no friction, no pollution, low noise, etc., so it has very important value in aerospace and mechanical manufacturing. In recent years, with the development of new high magnetic materials and electromagnetic theory. At present, it has become a hot research field of major universities and research institutes. At the same time, the magnetic levitation system is a complex and unstable system with mufti-degree of freedom, strong coupling and nonlinear fastness. Therefore, the magnetic levitation control system has become a hot spot and a difficult point in the field of control science. In this paper, a hardware platform of push-down magnetic levitation control system is constructed. The magnetic field of the floating magnetic field on the vertical component is collected by the Honeywell 3503 sensor placed diagonally. The linear signal is converted into an electrical signal and amplified by the operational amplifier. The STM32 reads and writes control information and uses it for the digital filtering algorithm and the run control algorithm to apply the calculated data to the power amplifier component to drive the helical coil to generate a corrected magnetic field. Keep the float in dynamic balance and achieve the desired control effect.

Index Terms— magnetic levitation control; anti-integration saturation PID; STM32

Wang Yongliang, Li Xinqi, Yan Daliang, Lu Dengcheng
School of Automation and Electrical Engineering, Tianjin University of Technology and Education, CHINA
Chen Hongdou
Sanshui District Industrial Secondary School in Foshan City, CHINA


Cite: Wang Yongliang, Li Xinqi, Chen Hongdou, Yan Daliang, Lu Dengcheng, "The design of Push-down magnetic levitation system," Proceedings of 2019 the 9th International Workshop on Computer Science and Engineering, pp. 863-868, Hong Kong, 15-17 June, 2019.